SEMICONDUCTOR PACKAGE

A semiconductor package includes a redistribution substrate having a semiconductor chip mounted on a top surface thereof with and a connection terminal between the semiconductor chip and the redistribution substrate. The redistribution substrate includes a first redistribution pattern on a bottom su...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LEE, Seokhyun, KIM, Jongyoun, JEON, Gwangjae
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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