SEMICONDUCTOR PACKAGE

A semiconductor package includes a redistribution substrate having a semiconductor chip mounted on a top surface thereof with and a connection terminal between the semiconductor chip and the redistribution substrate. The redistribution substrate includes a first redistribution pattern on a bottom surface of the connection terminal and comprising a first via and a first interconnection on the first via, a pad pattern between the first redistribution pattern and the connection terminal and comprising a pad via and a pad on the pad via, and a second redistribution pattern between the first redistribution pattern and the pad pattern and comprising a second via and a second interconnection on the second via with a recess region where a portion of a top surface of the second interconnection is recessed. A bottom surface of the recess region is located at a lower level than a topmost surface of the second interconnection.