SILICON ETCHANT COMPOSITION, PATTERN FORMATION METHOD AND MANUFACTURING METHOD OF ARRAY SUBSTRATE USING THE ETCHANT COMPOSITION, AND ARRAY SUBSTRATE MANUFACTURED THEREFROM

SILICON ETCHANT COMPOSITION, PATTERN FORMATION METHOD AND MANUFACTURING METHOD OF ARRAY SUBSTRATE USING THE ETCHANT COMPOSITION, AND ARRAY SUBSTRATE MANUFACTURED THEREFROM

The present disclosure relates to a silicon etchant composition comprising (A) an alkaline compound, (B) a metal salt, and (C) water, a pattern formation method and a manufacturing method of an array substrate using the silicon etchant composition, and an array substrate manufactured therefrom.

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Kim, Ji-Won, Shin, Woo-Jun, Roh, Jin-Kyu
Format: Patent
Sprache:eng
Schlagworte:
ADHESIVES
BASIC ELECTRIC ELEMENTS
CHEMISTRY
DYES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The present disclosure relates to a silicon etchant composition comprising (A) an alkaline compound, (B) a metal salt, and (C) water, a pattern formation method and a manufacturing method of an array substrate using the silicon etchant composition, and an array substrate manufactured therefrom.