DIFFERENT SCALING RATIO IN FEOL / MOL/ BEOL

The present disclosure, in some embodiments, relates to an integrated chip. The integrated chip includes a first contact and a second contact disposed over a substrate. A center of a first upper surface of the first contact is laterally separated from a center of a second upper surface of the second...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Lee, Liang-Yao, Tsai, Tsung-Chieh, Wu, Juing-Yi, Lee, Chun-Yi
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PHYSICS SEMICONDUCTOR DEVICES
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