SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE

A semiconductor module includes a heat dissipating plate; an insulating substrate disposed on an upper surface of the heat dissipating plate; a semiconductor element disposed an upper surface of the insulating substrate; a frame-shaped case bonded to the upper surface of the heat dissipating plate v...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: ENOMOTO, Kazuo
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor module includes a heat dissipating plate; an insulating substrate disposed on an upper surface of the heat dissipating plate; a semiconductor element disposed an upper surface of the insulating substrate; a frame-shaped case bonded to the upper surface of the heat dissipating plate via an adhesive so as to surround peripheries of the insulating substrate and the semiconductor element; and a sealing resin that fills an inner space defined by the frame-shaped case and the heat dissipating plate so as to seal the insulating substrate and the semiconductor element, wherein at an interface between the heat dissipating plate and the frame-shaped case, a recess communicating with the inner space is formed in at least one of the frame-shaped case and the heat dissipating plate, and the sealing resin is filled in the recess.