POLISHING COMPOSITIONS AND METHODS OF USING THE SAME

This disclosure relates to a polishing composition that includes at least one abrasive; at least one pH adjuster, and at least one biosurfactant, as well as a method of using the polishing composition to polish a substrate. The biosurfactant can be selected from the group consisting of glycolipids,...

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Bibliographische Detailangaben
Hauptverfasser:	Turner, Eric, Schaefer, Zachary L, Ballesteros, Carl
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	This disclosure relates to a polishing composition that includes at least one abrasive; at least one pH adjuster, and at least one biosurfactant, as well as a method of using the polishing composition to polish a substrate. The biosurfactant can be selected from the group consisting of glycolipids, lipopeptides, and mixtures thereof.