RESIN MOLDING SYSTEM AND RESIN MOLDING METHOD

A resin molding system 1 comprises a gripping device 3 provided with a gripping frame 30 for gripping a resin sheet material 2, a heating device for heating the resin sheet material 2 and a molding device for clamping a lower die 61 and an upper die and affixing the resin sheet material 2 to a subst...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE, Chiriki, SHINNO, Yushi, WATANABE, Koji, ARAHATA, Yasushi, TAKAMURA, Yusuke
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A resin molding system 1 comprises a gripping device 3 provided with a gripping frame 30 for gripping a resin sheet material 2, a heating device for heating the resin sheet material 2 and a molding device for clamping a lower die 61 and an upper die and affixing the resin sheet material 2 to a substrate 63. The molding device is provided with: a lowering device for lowering the gripping device 3 and causing the resin sheet material 2 gripped by the gripping frame 30 to approach the lower die 61; and a pair of bent posts 67, 68 which are provided on both Y-direction sides of the lower die 61, and which come in contact with portions of the gripping frame 30 when the gripping device 3 is lowered, and which convexly bend the gripping frame 30 upward as viewed from the side along the Y-direction.