SEMICONDUCTOR PACKAGE WITH STIFFENER

SEMICONDUCTOR PACKAGE WITH STIFFENER

A semiconductor package includes a substrate, a semiconductor stack mounted on the substrate, and a stiffener surrounding the semiconductor stack, the stiffener having an octagonal shape at an edge of an upper surface thereof. A minimum distance from one angular point of an upper surface of the subs...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: RYU, Hansung
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package includes a substrate, a semiconductor stack mounted on the substrate, and a stiffener surrounding the semiconductor stack, the stiffener having an octagonal shape at an edge of an upper surface thereof. A minimum distance from one angular point of an upper surface of the substrate to the stiffener is determined based on the thickness of the substrate.