Adhesive tape with polyurethane carrier

The present invention relates to an adhesive tape comprising at least one carrier that has a thickness of 20 to 250 μm, preferably 50 to 150 μm, and has at least one layer (i) based on preferably uncrosslinked thermoplastic polyurethane that has been produced by means of extrusion, wherein the polyu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Lohmann, Franciska, Czerwonatis, Franziska
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to an adhesive tape comprising at least one carrier that has a thickness of 20 to 250 μm, preferably 50 to 150 μm, and has at least one layer (i) based on preferably uncrosslinked thermoplastic polyurethane that has been produced by means of extrusion, wherein the polyurethane is based on aromatic polyisocyanate, such as aromatic diisocyanate in particular, or (ii) based on preferably uncrosslinked polyurethane that has been produced from a dispersion, wherein a pressure-sensitive adhesive layer is disposed on at least one side, preferably both sides, of the carrier. The invention also relates to processes for producing the adhesive tape and to the use thereof for bonding of components in electrical, electronic, optical or precision mechanical devices, such as, in particular, of windows or lenses in housings of precision mechanical, optical and/or electronic devices.