APPARATUS DESIGN FOR PHOTORESIST DEPOSITION

In an embodiment, the a semiconductor processing tool is disclosed. In an embodiment, the semiconductor processing tool comprises a chamber, and a displaceable column that passes through a surface of the chamber. In an embodiment, the column comprises a base plate, an insulator layer over the base p...

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Bibliographische Detailangaben
Hauptverfasser:	Chan, Kelvin, Subramani, Anantha, Houshmand, Farzad
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	In an embodiment, the a semiconductor processing tool is disclosed. In an embodiment, the semiconductor processing tool comprises a chamber, and a displaceable column that passes through a surface of the chamber. In an embodiment, the column comprises a base plate, an insulator layer over the base plate, a pedestal over the insulator layer, and an edge ring surrounding a perimeter of the ground plate, the insulator and the pedestal. In an embodiment, a fluidic path is provided between the edge ring and the pedestal.