ELECTROLESS PALLADIUM PLATING BATH

A plating bath at least contains a palladium compound, a reducing agent, a complexing agent, and a stabilizer. The stabilizer is an organic compound in which a divalent sulfur compound is bonded to a compound with a heterocyclic structure, and the organic compound contains neither a thiol group nor...

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Bibliographische Detailangaben
Hauptverfasser:	MAEKAWA, Takuma, TANABE, Katsuhisa, SHIBATA, Toshiaki
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	A plating bath at least contains a palladium compound, a reducing agent, a complexing agent, and a stabilizer. The stabilizer is an organic compound in which a divalent sulfur compound is bonded to a compound with a heterocyclic structure, and the organic compound contains neither a thiol group nor a disulfide bond.