SEMICONDUCTOR PACKAGES WITH INTEGRATED SHIELDING

SEMICONDUCTOR PACKAGES WITH INTEGRATED SHIELDING

The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip b...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SHIM, Il Kwon, ROBLES, Roel Adeva, DUMSONG, Eakkasit, SIRINORAKUL, Saravuth, LOCK, Kok Chuen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:The present disclosure is directed to improving EMI shielding to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. An integrated shielding structure may be disposed in between the package substrate and the encapsulant to shield internal and/or external EMI. For example, a top surface of the integrated shield structure is exposed.