POLISHING PADS AND SYSTEMS AND METHODS OF MAKING AND USING THE SAME

A polishing pad includes a polishing layer having a first major surface and a second major surface opposite the first major surface. The polishing pad further includes a subpad, which is coupled to the polishing layer, and has a first major surface and a second major surface opposite the first major...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lehuu, Duy K, Lin, Qin, Javid, Samad, Muradian, David J
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A polishing pad includes a polishing layer having a first major surface and a second major surface opposite the first major surface. The polishing pad further includes a subpad, which is coupled to the polishing layer, and has a first major surface and a second major surface opposite the first major surface. At least 50% of the subpad, based on the total surface area of the first major surface of the subpad, is optically transparent.