THERMOELECTRIC MODULE

Disclosed is a thermoelectric module. One embodiment of the thermoelectric modules comprises: a first substrate; a first electrode disposed on the first substrate; a thermoelectric leg disposed on the first electrode; a second electrode disposed on the thermoelectric leg; a second substrate disposed on the second electrode; a plurality of wire parts electrically connected to the first electrode and the second electrode; a first sealing part disposed on the first substrate and surrounding the side surface of the second substrate; and a second sealing part passing through the first sealing part and disposed on the inside and outside of the first sealing part. At least one of the plurality of wire parts is partially disposed inside the second sealing part. The second sealing part includes: a first region which is closest to the first sealing part outside the first sealing part; and a second region which is disposed outside the first region and is in contact with the wire part partially disposed inside the second sealing part, wherein the thickness of the second region is less than the thickness of the first region.