ELECTRONIC CHIP PACKAGE HAVING A SUPPORT AND A CONDUCTIVE LAYER ON THE SUPPORT

The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.

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Bibliographische Detailangaben
Hauptverfasser:	JAILLET, Romain, ORY, Olivier
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	The invention concerns a device comprising a support, an electrically-conductive layer covering the support, a semiconductor substrate on the conductive layer, and an insulating casing.