PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE
The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.
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creator | LEE, Seul Ki KIM, Jun Hwan HEO, Sun Hee KIM, Jun Ki BAE, Jun LEE, Dae Won YOO, Chung Youl JO, Yong Jeong AHN, Sang Yeob |
description | The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022019144A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022019144A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022019144A13</originalsourceid><addsrcrecordid>eNrjZLAN8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvpKLh5-vjqKDj6uSi4-rg6hwT5-3k6K7i4hnk6u_IwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDIyMDQ0tDExNHQ2PiVAEA7J8qzg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE</title><source>esp@cenet</source><creator>LEE, Seul Ki ; KIM, Jun Hwan ; HEO, Sun Hee ; KIM, Jun Ki ; BAE, Jun ; LEE, Dae Won ; YOO, Chung Youl ; JO, Yong Jeong ; AHN, Sang Yeob</creator><creatorcontrib>LEE, Seul Ki ; KIM, Jun Hwan ; HEO, Sun Hee ; KIM, Jun Ki ; BAE, Jun ; LEE, Dae Won ; YOO, Chung Youl ; JO, Yong Jeong ; AHN, Sang Yeob</creatorcontrib><description>The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220120&DB=EPODOC&CC=US&NR=2022019144A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220120&DB=EPODOC&CC=US&NR=2022019144A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, Seul Ki</creatorcontrib><creatorcontrib>KIM, Jun Hwan</creatorcontrib><creatorcontrib>HEO, Sun Hee</creatorcontrib><creatorcontrib>KIM, Jun Ki</creatorcontrib><creatorcontrib>BAE, Jun</creatorcontrib><creatorcontrib>LEE, Dae Won</creatorcontrib><creatorcontrib>YOO, Chung Youl</creatorcontrib><creatorcontrib>JO, Yong Jeong</creatorcontrib><creatorcontrib>AHN, Sang Yeob</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE</title><description>The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAN8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvpKLh5-vjqKDj6uSi4-rg6hwT5-3k6K7i4hnk6u_IwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDIyMDQ0tDExNHQ2PiVAEA7J8qzg</recordid><startdate>20220120</startdate><enddate>20220120</enddate><creator>LEE, Seul Ki</creator><creator>KIM, Jun Hwan</creator><creator>HEO, Sun Hee</creator><creator>KIM, Jun Ki</creator><creator>BAE, Jun</creator><creator>LEE, Dae Won</creator><creator>YOO, Chung Youl</creator><creator>JO, Yong Jeong</creator><creator>AHN, Sang Yeob</creator><scope>EVB</scope></search><sort><creationdate>20220120</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE</title><author>LEE, Seul Ki ; KIM, Jun Hwan ; HEO, Sun Hee ; KIM, Jun Ki ; BAE, Jun ; LEE, Dae Won ; YOO, Chung Youl ; JO, Yong Jeong ; AHN, Sang Yeob</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022019144A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, Seul Ki</creatorcontrib><creatorcontrib>KIM, Jun Hwan</creatorcontrib><creatorcontrib>HEO, Sun Hee</creatorcontrib><creatorcontrib>KIM, Jun Ki</creatorcontrib><creatorcontrib>BAE, Jun</creatorcontrib><creatorcontrib>LEE, Dae Won</creatorcontrib><creatorcontrib>YOO, Chung Youl</creatorcontrib><creatorcontrib>JO, Yong Jeong</creatorcontrib><creatorcontrib>AHN, Sang Yeob</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, Seul Ki</au><au>KIM, Jun Hwan</au><au>HEO, Sun Hee</au><au>KIM, Jun Ki</au><au>BAE, Jun</au><au>LEE, Dae Won</au><au>YOO, Chung Youl</au><au>JO, Yong Jeong</au><au>AHN, Sang Yeob</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE</title><date>2022-01-20</date><risdate>2022</risdate><abstract>The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS |
title | PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE |
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