PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE

The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.

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Hauptverfasser: LEE, Seul Ki, KIM, Jun Hwan, HEO, Sun Hee, KIM, Jun Ki, BAE, Jun, LEE, Dae Won, YOO, Chung Youl, JO, Yong Jeong, AHN, Sang Yeob
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creator LEE, Seul Ki
KIM, Jun Hwan
HEO, Sun Hee
KIM, Jun Ki
BAE, Jun
LEE, Dae Won
YOO, Chung Youl
JO, Yong Jeong
AHN, Sang Yeob
description The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_US2022019144A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>US2022019144A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_US2022019144A13</originalsourceid><addsrcrecordid>eNrjZLAN8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvpKLh5-vjqKDj6uSi4-rg6hwT5-3k6K7i4hnk6u_IwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDIyMDQ0tDExNHQ2PiVAEA7J8qzg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE</title><source>esp@cenet</source><creator>LEE, Seul Ki ; KIM, Jun Hwan ; HEO, Sun Hee ; KIM, Jun Ki ; BAE, Jun ; LEE, Dae Won ; YOO, Chung Youl ; JO, Yong Jeong ; AHN, Sang Yeob</creator><creatorcontrib>LEE, Seul Ki ; KIM, Jun Hwan ; HEO, Sun Hee ; KIM, Jun Ki ; BAE, Jun ; LEE, Dae Won ; YOO, Chung Youl ; JO, Yong Jeong ; AHN, Sang Yeob</creatorcontrib><description>The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.</description><language>eng</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MATERIALS THEREFOR ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220120&amp;DB=EPODOC&amp;CC=US&amp;NR=2022019144A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220120&amp;DB=EPODOC&amp;CC=US&amp;NR=2022019144A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>LEE, Seul Ki</creatorcontrib><creatorcontrib>KIM, Jun Hwan</creatorcontrib><creatorcontrib>HEO, Sun Hee</creatorcontrib><creatorcontrib>KIM, Jun Ki</creatorcontrib><creatorcontrib>BAE, Jun</creatorcontrib><creatorcontrib>LEE, Dae Won</creatorcontrib><creatorcontrib>YOO, Chung Youl</creatorcontrib><creatorcontrib>JO, Yong Jeong</creatorcontrib><creatorcontrib>AHN, Sang Yeob</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE</title><description>The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MATERIALS THEREFOR</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAN8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvpKLh5-vjqKDj6uSi4-rg6hwT5-3k6K7i4hnk6u_IwsKYl5hSn8kJpbgZlN9cQZw_d1IL8-NTigsTk1LzUkvjQYCMDIyMDQ0tDExNHQ2PiVAEA7J8qzg</recordid><startdate>20220120</startdate><enddate>20220120</enddate><creator>LEE, Seul Ki</creator><creator>KIM, Jun Hwan</creator><creator>HEO, Sun Hee</creator><creator>KIM, Jun Ki</creator><creator>BAE, Jun</creator><creator>LEE, Dae Won</creator><creator>YOO, Chung Youl</creator><creator>JO, Yong Jeong</creator><creator>AHN, Sang Yeob</creator><scope>EVB</scope></search><sort><creationdate>20220120</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE</title><author>LEE, Seul Ki ; KIM, Jun Hwan ; HEO, Sun Hee ; KIM, Jun Ki ; BAE, Jun ; LEE, Dae Won ; YOO, Chung Youl ; JO, Yong Jeong ; AHN, Sang Yeob</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_US2022019144A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2022</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MATERIALS THEREFOR</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>LEE, Seul Ki</creatorcontrib><creatorcontrib>KIM, Jun Hwan</creatorcontrib><creatorcontrib>HEO, Sun Hee</creatorcontrib><creatorcontrib>KIM, Jun Ki</creatorcontrib><creatorcontrib>BAE, Jun</creatorcontrib><creatorcontrib>LEE, Dae Won</creatorcontrib><creatorcontrib>YOO, Chung Youl</creatorcontrib><creatorcontrib>JO, Yong Jeong</creatorcontrib><creatorcontrib>AHN, Sang Yeob</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>LEE, Seul Ki</au><au>KIM, Jun Hwan</au><au>HEO, Sun Hee</au><au>KIM, Jun Ki</au><au>BAE, Jun</au><au>LEE, Dae Won</au><au>YOO, Chung Youl</au><au>JO, Yong Jeong</au><au>AHN, Sang Yeob</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE</title><date>2022-01-20</date><risdate>2022</risdate><abstract>The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.</abstract><oa>free_for_read</oa></addata></record>
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source esp@cenet
subjects APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
title PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-11T13%3A28%3A32IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=LEE,%20Seul%20Ki&rft.date=2022-01-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EUS2022019144A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true