PHOTOSENSITIVE RESIN COMPOSITION, FILM, AND ELECTRONIC DEVICE

The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.

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Bibliographische Detailangaben
Hauptverfasser:	LEE, Seul Ki, KIM, Jun Hwan, HEO, Sun Hee, KIM, Jun Ki, BAE, Jun, LEE, Dae Won, YOO, Chung Youl, JO, Yong Jeong, AHN, Sang Yeob
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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Beschreibung
Zusammenfassung:	The present disclosure can provide a photosensitive resin composition, film, and electronic device having excellent high-resolution patterning at low light intensity, excellent pattern adhesion, fine patterning, and excellent cured film properties.