PACKAGE ACCOMMODATING HEAT DISSIPATION SUBSTRATE AND PACKING BOX

A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GOTO, Daisuke, OTA, Hiroaki, ISHIHARA, Yosuke
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A plurality of heat dissipation substrates stacked on each other, intermediate sheets disposed under a lowermost heat dissipation substrate, on an uppermost heat dissipation substrate, and between heat dissipation substrates adjacent to each other, a drying agent disposed over or under the plurality of heat dissipation substrates, and a bag that seals the plurality of heat dissipation substrates, the plurality of intermediate sheets, and the drying agent.