SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

The present disclosure provides a semiconductor device and a fabrication method thereof. The semiconductor device includes a III-V material layer, a first gate, a second gate, and a first passivation layer. The first gate and the second gate are on the III-V material layer. The first passivation lay...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: GAO, Wuhao, CHEN, Zu Er, ZHAO, Qiyue
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure provides a semiconductor device and a fabrication method thereof. The semiconductor device includes a III-V material layer, a first gate, a second gate, and a first passivation layer. The first gate and the second gate are on the III-V material layer. The first passivation layer is on the first gate. A first activation ratio of an element in the first gate is different from a second activation ratio of the element in the second gate.