POLISHING LIQUID COMPOSITION FOR SILICON OXIDE FILM

Provided is a polishing liquid composition that is able to improve the polishing rate of a silicon oxide film in one aspect.An aspect of the present disclosure relates to a polishing liquid composition for a silicon oxide film. The polishing liquid composition contains cerium oxide particles (compon...

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Bibliographische Detailangaben
Hauptverfasser: SEIKE, Takanao, DOI, Haruhiko, SUGAHARA, Masato, YAMAGUCHI, Norihito, INOUE, Masaki
Format: Patent
Sprache:eng
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Zusammenfassung:Provided is a polishing liquid composition that is able to improve the polishing rate of a silicon oxide film in one aspect.An aspect of the present disclosure relates to a polishing liquid composition for a silicon oxide film. The polishing liquid composition contains cerium oxide particles (component A), an additive (component B), and an aqueous medium. The component B is a compound having a reduction potential of (145 V or more when a 10 ppm aqueous solution of the component B is measured by cyclic voltammetry (with an Ag/AgCl electrode as a reference).