SEALED MULTILAYER STRUCTURES AND PACKAGES COMPRISING SEALED MULTILAYER STRUCTURES

Embodiments of the present invention relate to sealed multilayer structures, packages formed therefrom, and methods of forming packages. In one aspect, a sealed multilayer structure comprises: (a) a uniaxially oriented multilayer film having a first oriented film thickness, wherein the film is orien...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Goh, Hwee Lun, Yee, Wu Aik, Ma, Eng Kian
Format: Patent
Sprache:eng
Schlagworte:
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