SEALED MULTILAYER STRUCTURES AND PACKAGES COMPRISING SEALED MULTILAYER STRUCTURES

Embodiments of the present invention relate to sealed multilayer structures, packages formed therefrom, and methods of forming packages. In one aspect, a sealed multilayer structure comprises: (a) a uniaxially oriented multilayer film having a first oriented film thickness, wherein the film is orien...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Goh, Hwee Lun, Yee, Wu Aik, Ma, Eng Kian
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Embodiments of the present invention relate to sealed multilayer structures, packages formed therefrom, and methods of forming packages. In one aspect, a sealed multilayer structure comprises: (a) a uniaxially oriented multilayer film having a first oriented film thickness, wherein the film is oriented in the machine direction at a draw ratio greater than 1:1 and less than 4:1, and (b) a second multilayer film comprising a sealant layer and having a second film thickness, wherein the sealant layer of the first oriented film is sealed to the sealant layer of the second film, and wherein the total thickness of the sealed films is at least 5 percent greater than the sum of the first oriented film thickness and the second film thickness.