THROUGH-HOLE FORMING METHOD AND THROUGH-HOLE FORMING DEVICE

The purpose of the present invention is to, after a through-hole is formed in a plurality of members between which a sealant is applied, rapidly and easily remove the sealant flowing into the through-hole. This through-hole forming method is provided with: a step (S2) in which a cutting tool rotates...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: IKADA, Akira, TAKAHAGI, Michinobu, NAKAMURA, Ryo, TSUKIOKA, Yuki
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The purpose of the present invention is to, after a through-hole is formed in a plurality of members between which a sealant is applied, rapidly and easily remove the sealant flowing into the through-hole. This through-hole forming method is provided with: a step (S2) in which a cutting tool rotates about the axis thereof, thereby forming a through-hole in a plurality of members between which a sealant is provided; and a step (S4) in which after the through-hole is formed, the cutting tool continues the rotation about the axis thereof for a predetermined time or a predetermined number of rotations, thereby removing the sealant flowing into the through-hole.