METHOD AND DEVICE FOR FAILURE ANALYSIS USING RF-BASED THERMOMETRY

METHOD AND DEVICE FOR FAILURE ANALYSIS USING RF-BASED THERMOMETRY

According to the various examples, a fully integrated system and method for failure analysis using RF-based thermometry enable the detection and location of defects and failures in complex semiconductor packaging architectures. The system provides synchronous amplified RF signals to generate unique...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kaira, Chandrashekara Shashank, Miller, Phillip C, Muthur Srinath, Purushotham Kaushik, Goyal, Deepak
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
COLORIMETRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT
MEASURING
PHYSICS
RADIATION PYROMETRY
SEMICONDUCTOR DEVICES
TESTING
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Beschreibung
Zusammenfassung:According to the various examples, a fully integrated system and method for failure analysis using RF-based thermometry enable the detection and location of defects and failures in complex semiconductor packaging architectures. The system provides synchronous amplified RF signals to generate unique thermal signatures at defect locations based on dielectric relaxation loss and heating.