RESIST PATTERN FORMING METHOD AND SEMICONDUCTOR CHIP MANUFACTURING METHOD

An object of the present invention is to provide a resist pattern forming method that has excellent pattern forming properties and generates few residues and a semiconductor chip manufacturing method. The resist pattern forming method according to an embodiment of the present invention has a step A...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Kawada, Yukihisa, KAMIMURA, Tetsuya, Yoshidome, Masahiro
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:An object of the present invention is to provide a resist pattern forming method that has excellent pattern forming properties and generates few residues and a semiconductor chip manufacturing method. The resist pattern forming method according to an embodiment of the present invention has a step A of forming a film on a substrate by using an actinic ray-sensitive or radiation-sensitive resin composition containing a photoacid generator and a resin whose polarity is increased by the action of an acid, a step B of exposing the film, step C of developing the exposed film by using an alkali developer, a step D of washing the developed film by using water, and a step E of washing the film washed in the step D by using a chemical liquid containing an alcohol-based solvent, in which the alkali developer contains a quaternary ammonium salt.