ADHESIVE FORMULATIONS

An adhesive formulation such as a hot melt adhesive or a pressure sensitive adhesive is provided comprising 5 to 98% (by weight) biodegradable substantially non-crystalline mcl-PHA. The mcl-PHA may be cured with a peroxide curing agent. The adhesive formulation may include an additional biodegradabl...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Reddy Chaganti, Srinivasa, Babu Padamati, Ramesh, O'Connor, Kevin, Morales-Gamez, Laura
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	An adhesive formulation such as a hot melt adhesive or a pressure sensitive adhesive is provided comprising 5 to 98% (by weight) biodegradable substantially non-crystalline mcl-PHA. The mcl-PHA may be cured with a peroxide curing agent. The adhesive formulation may include an additional biodegradable polymer, or a non-biodegradable thermoplastic elastomer. Hot melt adhesives comprising significant amounts of biodegradable mcl-PHA, waxes, and tackifiers are also provided.