ELECTRONIC COMPONENT ASSEMBLY

ELECTRONIC COMPONENT ASSEMBLY

The present embodiment relates to an electronic component assembly comprising: a housing; a heating element disposed inside the housing; a substrate disposed on the heating element; and a spacer disposed between the heating element and the substrate, wherein the substrate has a first hole coupled to...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: JUNG, Jae Hoo
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:The present embodiment relates to an electronic component assembly comprising: a housing; a heating element disposed inside the housing; a substrate disposed on the heating element; and a spacer disposed between the heating element and the substrate, wherein the substrate has a first hole coupled to the spacer, the heating element includes a first body having a second hole formed therethrough, and a connection part connected to the substrate, and the spacer includes a first protrusion coupled to the first hole, a second protrusion coupled to the second hole, and a second body disposed between the first protrusion and the second protrusion.