SURFACE PREPARATION SYSTEM AND METHOD FOR IMPROVING ADHESION

A method for improving adhesion is disclosed. In one exemplary embodiment, the method comprises providing a base substrate and emitting energy from an energy source onto a surface of the base substrate at a predetermined wavelength to achieve one or more material properties. The one or more material...

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Bibliographische Detailangaben
Hauptverfasser:	Subramaniam, Sankaran, Guthy, Hema V, Tortorella, Nathan F
Format:	Patent
Sprache:	eng
Schlagworte:	ALLOYS CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	A method for improving adhesion is disclosed. In one exemplary embodiment, the method comprises providing a base substrate and emitting energy from an energy source onto a surface of the base substrate at a predetermined wavelength to achieve one or more material properties. The one or more material properties including a surface elemental ratio of Aluminum to Magnesium between approximately 3 to 17, an elemental ratio of oxygen to carbon between 3 to 11, and a contact angle of less than 30 degrees such that upon application of an adhesive material an increased adhesive bond of predetermined strength is attained.