OVENS FOR EQUIPMENT SUCH AS DIE ATTACH SYSTEMS, FLIP CHIP BONDING SYSTEMS, CLIP ATTACH SYSTEMS, AND RELATED METHODS

An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a c...

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Bibliographische Detailangaben
1. Verfasser: Luechinger, Christoph Benno
Format: Patent
Sprache:eng
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Zusammenfassung:An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a conductive joint formation process; and (c) at least one vacuum chamber within the chamber. The oven provides a stepped temperature profile including a plurality of temperature zones along the oven plate.