Integrated Assemblies and Methods of Forming Integrated Assemblies

Integrated Assemblies and Methods of Forming Integrated Assemblies

Some embodiments include an integrated assembly having a vertical stack of alternating insulative levels and conductive levels. The insulative levels have a same primary composition as one another. At least one of the insulative levels is compositionally different relative to others of the insulativ...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wu, Jeslin J, Tiwari, Chandra, Abdelrahaman, Ramey M, Shrotri, Kunal, Lengade, Swapnil
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:Some embodiments include an integrated assembly having a vertical stack of alternating insulative levels and conductive levels. The insulative levels have a same primary composition as one another. At least one of the insulative levels is compositionally different relative to others of the insulative levels due to said at least one of the insulative levels including dopant dispersed within the primary composition. An opening extends vertically through the stack. Some embodiments include methods of forming integrated assemblies.