HOT-DIP PLATING METHOD

Provided is a hot-dip plating method that achieves good plating wettability between a metal material and a hot-dip plating bath and that makes it possible to reduce the amount of consumed energy as compared to conventional techniques. In a plating step included in the hot-dip plating method, vibrati...

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Bibliographische Detailangaben
Hauptverfasser: KAMOSHIDA, Shinichi, HATTORI, Yasunori, MIONO, Tadaaki, KOGA, Shinichi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided is a hot-dip plating method that achieves good plating wettability between a metal material and a hot-dip plating bath and that makes it possible to reduce the amount of consumed energy as compared to conventional techniques. In a plating step included in the hot-dip plating method, vibration is applied to a hot-dip plating bath such that the ratio of the average sound pressure level (excluding noise) over ranges each lying between sound pressure peaks at harmonic frequencies of a fundamental frequency to the average sound pressure level (excluding noise) over the measured frequency range in an acoustic spectrum is greater than 0.2.