CURABLE SEALANT COMPOSITIONS, SEAL CAP, AND METHODS OF MAKING AND USING THE SAME

Curable sealant compositions comprise the components: a) x weight percent of at least one polythiol; b) y weight percent of at least one unsaturated compound having at least two non-aromatic carbon-carbon double bonds, at least one carbon-carbon triple bond, or a combination thereof; c) from 0.01 to...

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Bibliographische Detailangaben
Hauptverfasser:	Swan, Michael D, Moser, William H, DeMoss, Susan E, Cook, Clinton J, Townsend, Erik M, Zook, Jonathan D
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	Curable sealant compositions comprise the components: a) x weight percent of at least one polythiol; b) y weight percent of at least one unsaturated compound having at least two non-aromatic carbon-carbon double bonds, at least one carbon-carbon triple bond, or a combination thereof; c) from 0.01 to 8 weight percent of at least one quaternary ammonium or phosphonium salt; d) from 0.05 to 10 weight percent of at least one organic peroxide; and e) optionally from 0.01 to 10 weight percent of a photoinitiator system capable of generating free radicals upon exposure to actinic radiation. Each of x and y represents a positive real number. The sum x+y is in the range of 72 to 99. The weight percent ranges of the components a)-e) are based on the total weight of the components a)-e). A seal cap including the curable sealant composition and methods of making and using the curable sealant compositions are also disclosed.