SEMICONDUCTOR DEVICE

A device includes a first III-V compound layer, a second III-V compound layer, a dielectric layer, a contact, a metal-containing layer, and a metal contact. The second III-V compound layer is over the first III-V compound layer. The dielectric layer is over the second III-V compound layer. The conta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOU, Jheng-Sheng, LIN, Hsin-Chih, CHEN, Lieh-Chuan, WANG, Shen-Ping, KUO, Chien-Li, CHU, Po-Tao, HUANG, Kun-Ming
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:A device includes a first III-V compound layer, a second III-V compound layer, a dielectric layer, a contact, a metal-containing layer, and a metal contact. The second III-V compound layer is over the first III-V compound layer. The dielectric layer is over the second III-V compound layer. The contact extends through the dielectric layer to the second III-V compound layer. The contact is in contact with a top surface of the dielectric layer and an inner sidewall of the dielectric layer. The metal-containing layer is over and in contact with the contact, and a portion of the metal-containing layer is directly above the dielectric layer. The metal contact is over and in contact with the metal-containing layer.