SYSTEMS FOR PROVIDING THERMAL MANAGEMENT TO INTEGRATED CIRCUITS

SYSTEMS FOR PROVIDING THERMAL MANAGEMENT TO INTEGRATED CIRCUITS

A processing unit disposed within a compute unit, where the compute unit includes a printed circuit board (PCB) that includes an integrated circuit; a first thermal management device, that includes a first vapor chamber thermally conductively coupled to a first side of the integrated circuit; and a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Wilcox, Robert Morris, Thurlow, Ernest M, Soo, Tiong Khai, Doria, Tiffany, Lin, Zidong, Hibbs, Richard Neville
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A processing unit disposed within a compute unit, where the compute unit includes a printed circuit board (PCB) that includes an integrated circuit; a first thermal management device, that includes a first vapor chamber thermally conductively coupled to a first side of the integrated circuit; and a first heatsink thermally conductively coupled to the first vapor chamber; and a second thermal management device, that includes a second vapor chamber; and a second heatsink thermally conductively coupled to the second vapor chamber, where the second thermal management device is thermally conductively coupled to the first thermal management device; where the PCB is interposed between the first thermal management device and the second thermal management device.