METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING MODIFIED PULSE BURST PROFILES

METHODS FOR LASER PROCESSING TRANSPARENT WORKPIECES USING MODIFIED PULSE BURST PROFILES

A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tbd of 380 ns or greater...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Sabonis, Vytautas, Malchus, Reinhard Moritz, Piech, Garrett Andrew, Juzumas, Valdemaras, Terbrueggen, Ralf Joachim, Marjanovic, Sasha
Format: Patent
Sprache:eng
Schlagworte:
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
SOLDERING OR UNSOLDERING
TRANSPORTING
WELDING
WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:A method of laser processing a transparent workpiece includes directing a pulsed laser beam into the transparent workpiece. The pulsed laser beam includes pulse bursts having 2 sub-pulses per pulse burst or more, each pulse burst of the pulsed laser beam has a burst duration Tbd of 380 ns or greater; and the pulsed laser beam forms a pulsed laser beam focal line in the transparent workpiece, the pulsed laser beam focal line inducing absorption in the transparent workpiece, the induced absorption producing a defect in the transparent workpiece. The pulsed laser beam focal line includes a wavelength λ, a spot size wo, and a Rayleigh range ZR that is greater thanFD⁢π⁢wo2λ,where FD is a dimensionless divergence factor comprising a value of 10 or greater.