SLURRY COMPOSITION AND METHOD FOR POLISHING AND INTEGRATGED CIRCUIT

A slurry composition, a polishing method and an integrated circuit are provided. The slurry composition includes a slurry and at least one rheology modifier. The slurry includes at least one liquid carrier, at least one abrasives and at least one oxidizer. The rheology modifier is dispensed in the s...

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Bibliographische Detailangaben
Hauptverfasser:	CUI, JI, CHEN, LIANG-GUANG, CHEN, KEI-WEI, LIANG, WEI-WEI, CHANG, TANG-KUEI, HSU, CHUN-WEI, LIU, CHI-JEN, WU, LIIEH, LIAO, KAO-FENG, HUANG, HUII, JANGJIAN, PENGUNG, HUANG, FU-MING
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS PAINTS POLISHES POLISHING COMPOSITIONS OTHER THAN FRENCH POLISH SEMICONDUCTOR DEVICES SKI WAXES
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Beschreibung
Zusammenfassung:	A slurry composition, a polishing method and an integrated circuit are provided. The slurry composition includes a slurry and at least one rheology modifier. The slurry includes at least one liquid carrier, at least one abrasives and at least one oxidizer. The rheology modifier is dispensed in the slurry. The polishing method includes using the slurry composition with the rheology modifier to polish a conductive layer.