SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS

SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS

A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the...

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Bibliographische Detailangaben
Hauptverfasser: Wang, Weili, Lu, Xin, Chin, CheeKeong, Yang, Chenlin, Deng, Qi, Di, Xiaofeng, Ng, Chaur Yang, Chiu, Chin-Tien, Yan, Junrong, Zhang, Cong
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.