METHOD OF TREATMENT OF AN ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR BONDING

METHOD OF TREATMENT OF AN ELECTRONIC CIRCUIT FOR A HYBRID MOLECULAR BONDING

A method of treatment of an electronic circuit including at a location at least one electrically-conductive test pad having a first exposed surface. The method includes the at least partial etching of the test pad from the first surface, and the forming on the electronic circuit of an interconnectio...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Jouve, Amandine, Fournel, Frank, Dubarry, Christophe, Bourjot, Emilie
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A method of treatment of an electronic circuit including at a location at least one electrically-conductive test pad having a first exposed surface. The method includes the at least partial etching of the test pad from the first surface, and the forming on the electronic circuit of an interconnection level covering said location and including, on the side opposite to said location, a second planar surface adapted for the performing of a hybrid molecular bonding.