SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND A METHOD OF FABRICATING THE SAME

A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first a...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KIM, SEUNG HWAN, OH, JUN YOUNG, PARK, JONGHO, KOH, Kyong Hwan, KIM, SANGSOO, JANG, DONG-JU
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor package including: a first package; a second package on the first package, the second package including a second package substrate, first and second semiconductor chips on the second package substrate, and a second molding part on the second package substrate and covering the first and second semiconductor chips; and a fill part between the first package and the second package, a first through hole that penetrates the second package substrate, the first through hole being between the first and second semiconductor chips, a second through hole that penetrates the second molding part, the second through hole being connected to the first through hole, and wherein the fill part has an extension disposed in the first through hole and the second through hole.