SEMICONDUCTOR STORAGE DEVICE AND MANUFACTURING METHOD THEREOF
A device includes a first semiconductor layer that includes a first region provided between a first insulating portion and first conductive layers, a second region provided between a second insulating portion and second conductive layers, and a third region provided between the first region and the...
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Sprache: | eng |
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Zusammenfassung: | A device includes a first semiconductor layer that includes a first region provided between a first insulating portion and first conductive layers, a second region provided between a second insulating portion and second conductive layers, and a third region provided between the first region and the second region. A first insulating layer includes a thickness (t1) from a surface in the first region to a gate insulating film. The first insulating layer includes a thickness (t2) from a surface in the second region to the gate insulating film. The first insulating layer includes a thickness (t3) from a surface in the third region to the gate insulating film, which is larger than t1-2 nanometers (nm), and larger than t2-2 nm. |
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