SEMICONDUCTOR STRUCTURE HAVING AIR GAP DIELECTRIC

The present disclosure provides a semiconductor structure for reducing capacitive coupling between adjacent conductive features. The semiconductor structure includes a base layer, a plurality of conductive lines, a plurality of dielectric pillars, and a sealing layer having a plurality of sealing ca...

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Bibliographische Detailangaben
1. Verfasser: LAI, CHUNI
Format: Patent
Sprache:eng
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