MOLDING PACKAGING MATERIAL, POWER STORAGE DEVICE PACKAGING CASE, AND POWER STORAGE DEVICE

Provided is a molding packaging material which is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layer 2...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: YOSHINO, Kenji, KARATSU, Makoto, NAGAOKA, Takashi
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:Provided is a molding packaging material which is capable of ensuring good slipperiness to secure good formability when molding the molding packaging material and is less likely to cause white powder on a surface of the packaging material. The molding packaging material includes a substrate layer 2 as an outer layer, a heat fusible resin layer 3 as an inner layer, and a metal foil layer 4 arranged between the two layers. The heat fusible resin layer 3 is composed of a single layer or a multi-layer. The innermost layer of the heat fusible resin layer 3 is made of a resin composition containing a heat fusible resin, an anti-blocking agent, a slip agent, and a fluoropolymer-based lubricant.