SEALING ARRANGEMENT, PLATE ASSEMBLY, ELECTROCHEMICAL SYSTEM, AND METHOD FOR PRODUCING A SEALING ARRANGEMENT
The present disclosure relates to a sealing arrangement, comprising: an elastomeric sealing element, which comprises a foamed material containing microspheres, and a metal layer having a surface structuring, the surface structuring comprising a plurality of depressions, wherein the sealing element i...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | The present disclosure relates to a sealing arrangement, comprising: an elastomeric sealing element, which comprises a foamed material containing microspheres, and a metal layer having a surface structuring, the surface structuring comprising a plurality of depressions, wherein the sealing element is configured as a coating of the metal layer and is arranged at least in some areas on the surface structuring, wherein a concentration of the microspheres in the sealing element, measured perpendicular to the surface of the metal layer, is inhomogeneous. The disclosure additionally relates to a plate assembly, to an electrochemical system, and to a method for producing the sealing arrangement. |
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