Substrate with Cut Semiconductor Pieces Having Measurement Test Structures for Semiconductor Metrology

Substrate with Cut Semiconductor Pieces Having Measurement Test Structures for Semiconductor Metrology

A device used for semiconductor metrology includes a substrate and a plurality of pieces from one or more semiconductor wafers. Each piece of the plurality of pieces is bonded to the substrate at a respective position on the substrate. Each piece of the plurality of pieces includes a respective inst...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: Dror, Chen
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CONTROL OR REGULATING SYSTEMS IN GENERAL
CONTROLLING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FUNCTIONAL ELEMENTS OF SUCH SYSTEMS
MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS ORELEMENTS
PHYSICS
REGULATING
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A device used for semiconductor metrology includes a substrate and a plurality of pieces from one or more semiconductor wafers. Each piece of the plurality of pieces is bonded to the substrate at a respective position on the substrate. Each piece of the plurality of pieces includes a respective instance of a measurement test structure and an alignment mark. Each piece of the plurality of pieces has a known location from the one or more semiconductor wafers.