THERMOPLASTIC RESIN COMPOSITION AND HOT-MELT ADHESIVE

The present invention relates to a thermoplastic resin composition containing a base polymer containing a propylene-based polymer (A) in which a melting endotherm (ΔH-D) is 0 J/g or more and 60 J/g or less, and a melting point (Tm-D) is not observed or is 0° C. or higher and 120° C. or lower; and a...

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Bibliographische Detailangaben
Hauptverfasser:	FUJII, Nozomu, KANAMARU, Masami, KOGA, Asami
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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Beschreibung
Zusammenfassung:	The present invention relates to a thermoplastic resin composition containing a base polymer containing a propylene-based polymer (A) in which a melting endotherm (ΔH-D) is 0 J/g or more and 60 J/g or less, and a melting point (Tm-D) is not observed or is 0° C. or higher and 120° C. or lower; and a propylene-based polymer (C) in which a melting endotherm (ΔH-D) is 20 J/g or more and 120 J/g or less, and a melting point (Tm-D) is higher than 120° C., the content of the propylene-based polymer (C) being 0.5 parts by mass or more and 100 parts by mass or less relative to 100 parts by mass of the content of the propylene-based polymer (A).