LOCAL POLISHING METHOD, LOCAL POLISHING DEVICE, AND CORRECTIVE POLISHING APPARATUS USING THE LOCAL POLISHING DEVICE

LOCAL POLISHING METHOD, LOCAL POLISHING DEVICE, AND CORRECTIVE POLISHING APPARATUS USING THE LOCAL POLISHING DEVICE

Provided is a local polishing technique suitable for corrective polishing. Press polishing is performed while supplying a polishing solution between a work and a work-polishing rotating tool locally pressed against the work, the polishing solution having abrasive grains composed of organic particles...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HASHIZUME, Hirokazu, MIMURA, Hidekazu, MATSUZAWA, Yusuke
Format: Patent
Sprache:eng
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Beschreibung
Zusammenfassung:Provided is a local polishing technique suitable for corrective polishing. Press polishing is performed while supplying a polishing solution between a work and a work-polishing rotating tool locally pressed against the work, the polishing solution having abrasive grains composed of organic particles with an average particle size of 5 μm or more dispersed in a liquid. The rotating tool is made of an elastic material.