COMPOSITION AND METAL INSULATING COVER MATERIAL

A composition containing a solvent and a polyimide resin precursor and/or polyimide resin, wherein the polyimide resin precursor and/or polyimide resin includes a compound represented by Formula (0) below and/or a compound represented by Formula (0′) below, and a compound including a functional grou...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ECHIGO, Yu, AOKI, Dai, SUGIYAMA, Jiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP
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