COMPOSITION AND METAL INSULATING COVER MATERIAL

A composition containing a solvent and a polyimide resin precursor and/or polyimide resin, wherein the polyimide resin precursor and/or polyimide resin includes a compound represented by Formula (0) below and/or a compound represented by Formula (0′) below, and a compound including a functional grou...

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Bibliographische Detailangaben
Hauptverfasser:	ECHIGO, Yu, AOKI, Dai, SUGIYAMA, Jiro
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRICITY INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	A composition containing a solvent and a polyimide resin precursor and/or polyimide resin, wherein the polyimide resin precursor and/or polyimide resin includes a compound represented by Formula (0) below and/or a compound represented by Formula (0′) below, and a compound including a functional group that reacts with a terminally cyclized product of the compound represented by Formula (0) below and/or the compound represented by Formula (0′) below.In Formula (0) and Formula (0′) above, R′ each independently represent a hydrogen atom or an alkyl group. Ra represents a tetracarboxylic acid residue. Rb represents a diamine residue. Ra and/or Rb includes one linking group including an active hydrogen and/or one or more and four or less substituents including an active hydrogen. p and q represent given integers.