WAFER PRODUCTION METHOD

A wafer production method includes a separation layer forming step of positioning, from an end surface, the focal point of a laser beam with a wavelength having transmissibility with respect to a semiconductor ingot, at a depth corresponding to the thickness of a wafer to be produced, and irradiatin...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	NOMOTO, Asahi
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM WORKING CEMENT, CLAY, OR STONE WORKING STONE OR STONE-LIKE MATERIALS
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