SYSTEM AND METHOD FOR SYSTEM LEVEL COOLING OF AN ARRAY OF MEMORY MODULES

A cooling system interface for system cooling of a plurality of memory modules comprises a plurality of thermal interface material (TIM) blankets and a heatsink comprising a plurality of conductive fins. A TIM blanket may be positioned on each memory module and the heatsink may be positioned relativ...

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Bibliographische Detailangaben

Hauptverfasser:	Mundt, Kevin Warren, Curtis, Robert Boyd
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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